Крупнейшая в мире платформа для поставок недостающих и труднодоступных деталей

Зачем добавлять адсорбент и контроль влажности в упаковку чипсов

Опубликованное время: 2024-06-20 14:46:27
The main purpose of adding desiccant and controlling humidity in chip packaging is to ensure the performance and reliability of the product.

The main purpose of adding desiccant and controlling humidity in chip packaging is to prevent the chip from moisture, oxidized corrosion and deterioration of electrical properties after moisture, so as to ensure the performance and reliability of the product.

 

I. Role of Desiccant

The metal lines and pin pads in the chip are susceptible to moisture, and oxidation and corrosion would occur after contact with moisture, which would seriously affect the performance and reliability of the chip. Therefore, the chip in the packaging process need to add desiccant, the chip and its surrounding environment to reduce the humidity to zero, so as to prevent the chip moisture erosion. The common desiccant with quicklime and silica gel, these materials can absorb the surrounding moisture, so that the humidity in the environment to reduce.

 

II. Role of Humidity Control

In the chip packaging process, in addition to adding desiccant, but also need to control the humidity of the packaging environment. Under normal circumstances, the humidity of the packaging environment of the chip should be between 30% and 60%, which will have a negative impact on the chip beyond this range. When the humidity is too low, it will lead to chip drying, shrinkage, deformation and failure; while too high humidity will lead to dew on the chip surface, and even form water droplets inside the package, leading to chip short-circuit or even complete failure. Therefore, it is necessary to control the humidity in the packaging process and keep it within the normal range.

 

III. Realization Methods

The role of desiccant and humidity control is to protect the reliability and long-term stability of the chip, so it must be considered in the packaging process of the chip. For the selection and placement of desiccant location, it is generally necessary to select according to the specific type of chip and requirements. Meanwhile, there is a need to control the temperature and humidity of the packaging room, to avoid the external humidity and temperature on the chip packaging caused by adverse effects. In operation, sensors and other equipment are often used to monitor the environment, and then adjust the temperature, humidity and ventilation and other factors in a timely manner, so as to ensure the quality of chip packaging.

 

Conclusion

Chip is one of the core components of electronic products, and its reliability and performance are very important. To guarantee the performance and reliability of the chip, it is necessary to add desiccant and control humidity in the packaging process of the chip. In actual operation, it is required to select and place desiccant according to specific chip types and requirements, and use sensors and other equipment for environmental monitoring and control to ensure the quality of chip packaging.


————————

About Perceptive Components Limited

We are one of the world's leading distributors of semiconductor and electronic components. With 21 years of business experience in the electronic components industry, we have in-depth cooperative relations with thousands of brand manufacturers and agents, focusing on TI, Microchip, NXP, Infineon, Intel, onsemi, ST, Micron.

To learn more about Perceptive, visit perceptive-ic.com2024050715541099b570986.jpg

Linkedin

Facebook

Instagram

Twitter

YouTube

Рекомендуемые детали